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 2N6426, 2N6427
2N6426 is a Preferred Device
Darlington Transistors
NPN Silicon
Features
* These are Pb-Free Devices*
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COLLECTOR 3
MAXIMUM RATINGS
Rating Collector - Emitter Voltage Collector - Base Voltage Emitter - Base Voltage Collector Current - Continuous Total Device Dissipation @ TA = 25C Derate above 25C Total Device Dissipation @ TC = 25C Derate above 25C Operating and Storage Junction Temperature Range Symbol VCEO VCBO VEBO IC PD PD TJ, Tstg Value 40 40 12 500 625 5.0 1.5 12 -55 to +150 Unit Vdc Vdc Vdc mAdc mW mW/C W mW/C C 3 STRAIGHT LEAD BULK PACK 12 1 3 BENT LEAD TAPE & REEL AMMO PACK 2 TO-92 CASE 29 STYLE 1 EMITTER 1 BASE 2
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Symbol RqJA RqJC Max 200 83.3 Unit C/W C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
MARKING DIAGRAM
2N 642x AYWW G G
x = 6 or 7 A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Preferred devices are recommended choices for future use and best overall value.
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2007
1
March, 2007 - Rev. 3
Publication Order Number: 2N6426/D
2N6426, 2N6427
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic OFF CHARACTERISTICS Collector -Emitter Breakdown Voltage, (Note 1) (IC = 10 mAdc, VBE = 0) Collector -Base Breakdown Voltage (IC = 100 mAdc, IE = 0) Emitter -Base Breakdown Voltage (IE = 10 mAdc, IC = 0) Collector Cutoff Current (VCE = 25 Vdc, IB = 0) Collector Cutoff Current (VCB= 30 Vdc, IE = 0) Emitter Cutoff Current (VEB= 10 Vdc, IC = 0) ON CHARACTERISTICS DC Current Gain, (Note 1) (IC = 10 mAdc, VCE = 5.0 Vdc) (IC = 100 mAdc, VCE = 5.0 Vdc) (IC = 500 mAdc, VCE = 5.0 Vdc) Collector -Emitter Saturation Voltage (IC = 50 mAdc, IB = 0.5 mAdc) (IC = 500 mAdc, IB = 0.5 mAdc Base -Emitter Saturation Voltage (IC = 500 mAdc, IB = 0.5 mAdc) Base -Emitter On Voltage (IC = 50 mAdc, VCE = 5.0 Vdc) SMALL-SIGNAL CHARACTERISTICS Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Input Capacitance (VEB = 1.0 Vdc, IC = 0, f = 1.0 MHz) Input Impedance (IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz) Small-Signal Current Gain (IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz) Current -Gain - High Frequency (IC = 10 mAdc, VCE = 5.0 Vdc, f = 100 MHz) Output Admittance (IC = 10 mAdc, VCE = 5.0 Vdc, f = 1.0 kHz) Noise Figure (IC = 1.0 mAdc, VCE = 5.0 Vdc, RS = 100 kW, f = 1.0 kHz) 1. Pulse Test: Pulse Width v 300 ms; Duty Cycle v 2.0%. 2N6426 2N6427 hfe 2N6426 2N6427 |hfe| 2N6426 2N6427 hoe NF 1.5 1.3 - - 2.4 2.4 - 3.0 - - 1000 10 mmhos dB 20,000 10,000 - - - - - Cobo Cibo hie 100 50 - - 2000 1000 - - - 5.4 10 7.0 15 pF pF kW hFE 2N6426 2N6427 2N6426 2N6427 2N6426 2N6427 VCE(sat) - - VBE(sat) VBE(on) - - 0.71 0.9 1.52 1.24 1.2 1.5 2.0 1.75 Vdc Vdc 20,000 10,000 30,000 20,000 20,000 14,000 - - - - - - 200,000 100,000 300,000 200,000 200,000 140,000 Vdc - V(BR)CEO V(BR)CBO V(BR)EBO ICES ICBO IEBO 40 40 12 - - - - - - - - - - - - 1.0 50 50 Vdc Vdc Vdc mAdc nAdc nAdc Symbol Min Typ Max Unit
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2
2N6426, 2N6427
RS
in en
IDEAL TRANSISTOR
Figure 1. Transistor Noise Model
NOISE CHARACTERISTICS
(VCE = 5.0 Vdc, TA = 25C)
500 200 100 10 mA 50 100 mA 20 IC = 1.0 mA 10 5.0 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k f, FREQUENCY (Hz) 50 k 100 k 2.0 BANDWIDTH = 1.0 Hz i n, NOISE CURRENT (pA) 1.0 0.7 0.5 0.3 0.2 0.1 0.07 0.05 0.03 0.02 10 20 50 100 200 500 1 k 2 k 5 k 10 k 20 k f, FREQUENCY (Hz) 50 k 100 k 100 mA 10 mA
BANDWIDTH = 1.0 Hz RS 0
en, NOISE VOLTAGE (nV)
IC = 1.0 mA
Figure 2. Noise Voltage
Figure 3. Noise Current
VT, TOTAL WIDEBAND NOISE VOLTAGE (nV)
200 BANDWIDTH = 10 Hz TO 15.7 kHz NF, NOISE FIGURE (dB) IC = 10 mA
14 BANDWIDTH = 10 Hz TO 15.7 kHz 12
100 70 50 30 20
10 8.0 6.0 4.0 2.0 IC = 1.0 mA 100 mA
10 mA
100 mA
1.0 mA 10
1.0
2.0
5.0
10 20 50 100 200 RS, SOURCE RESISTANCE (kW)
500
1000
0 1.0
2.0
5.0
10 20 50 100 200 RS, SOURCE RESISTANCE (kW)
500
1000
Figure 4. Total Wideband Noise Voltage
Figure 5. Wideband Noise Figure
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3
2N6426, 2N6427
SMALL-SIGNALCHARACTERISTICS
20 TJ = 25C |h fe |, SMALL-SIGNAL CURRENT GAIN 4.0 VCE = 5.0 V f = 100 MHz TJ = 25C
C, CAPACITANCE (pF)
10 7.0 5.0
2.0
Cibo Cobo
1.0 0.8 0.6 0.4
3.0
2.0 0.04
0.1
0.2 0.4 1.0 2.0 4.0 VR, REVERSE VOLTAGE (VOLTS)
10
20
40
0.2 0.5
1.0
2.0
0.5 10 20 50 100 200 IC, COLLECTOR CURRENT (mA)
500
Figure 6. Capacitance
Figure 7. High Frequency Current Gain
200 k TJ = 125C hFE, DC CURRENT GAIN 100 k 70 k 50 k 30 k 20 k 10 k 7.0 k 5.0 k 3.0 k 2.0 k 5.0 7.0 10 20 30 50 70 100 200 300 IC, COLLECTOR CURRENT (mA) 500
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
3.0 TJ = 25C 2.5 IC = 10 mA 50 mA 250 mA 500 mA
25C
2.0
1.5
-55 C VCE = 5.0 V
1.0 0.5 0.1 0.2
0.5 1.0 2.0 5.0 10 20 50 IB, BASE CURRENT (mA)
100 200
500 1000
Figure 8. DC Current Gain
Figure 9. Collector Saturation Region
RV, TEMPERATURE COEFFICIENTS (mV/C)
1.6 TJ = 25C 1.4 V, VOLTAGE (VOLTS) VBE(sat) @ IC/IB = 1000 1.2 VBE(on) @ VCE = 5.0 V 1.0
-1.0 -2.0 -3.0
*APPLIES FOR IC/IB hFE/3.0 *RqVC FOR VCE(sat)
25C TO 125C
-55 C TO 25C
25C TO 125C -4.0 qVB FOR VBE -5.0 -6.0 5.0 7.0 10 -55 C TO 25C
0.8 0.6
VCE(sat) @ IC/IB = 1000 5.0 7.0 10 20 30 50 70 100 200 300 IC, COLLECTOR CURRENT (mA) 500
20 30 50 70 100 200 300 IC, COLLECTOR CURRENT (mA)
500
Figure 10. "On" Voltages
Figure 11. Temperature Coefficients
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4
2N6426, 2N6427
1.0 0.7 0.5 0.3 0.2 0.1 0.1 0.07 0.05 0.03 0.02 0.01 0.1 0.05 SINGLE PULSE
D = 0.5 0.2
RESISTANCE (NORMALIZED)
SINGLE PULSE ZqJC(t) = r(t) * RqJC TJ(pk) - TC = P(pk) ZqJC(t) ZqJA(t) = r(t) * RqJA TJ(pk) - TA = P(pk) ZqJA(t)
0.2
0.5
1.0
2.0
5.0
10
20 50 t, TIME (ms)
100
200
500
1.0 k
2.0 k
5.0 k
10 k
Figure 12. Thermal Response
IC, COLLECTOR CURRENT (mA)
1.0 k 700 500 300 200 100 70 50 30 20 10 0.4 0.6 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT TA = 25C TC = 25C
1.0 ms 100 ms 1.0 s
FIGURE A tP PP PP
t1 1/f 40 t DUTY CYCLE + t1 f + 1 tP PEAK PULSE POWER = PP
1.0 2.0 4.0 6.0 10 20 VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 13. Active Region Safe Operating Area
Design Note: Use of Transient Thermal Resistance Data
ORDERING INFORMATION
Device 2N6426G 2N6426RLRAG 2N6427G 2N6427RLRAG Package TO-92 (Pb-Free) TO-92 (Pb-Free) TO-92 (Pb-Free) TO-92 (Pb-Free) Shipping 5,000 Units / Bulk 2,000 / Tape & Ammo 5,000 Units / Bulk 2,000 / Tape & Ammo
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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5
2N6426, 2N6427
PACKAGE DIMENSIONS
TO-92 (TO-226) CASE 29-11 ISSUE AM
A R P L
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. DIM A B C D G H J K L N P R V INCHES MIN MAX 0.175 0.205 0.170 0.210 0.125 0.165 0.016 0.021 0.045 0.055 0.095 0.105 0.015 0.020 0.500 --- 0.250 --- 0.080 0.105 --- 0.100 0.115 --- 0.135 --- MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.407 0.533 1.15 1.39 2.42 2.66 0.39 0.50 12.70 --- 6.35 --- 2.04 2.66 --- 2.54 2.93 --- 3.43 ---
B
STRAIGHT LEAD BULK PACK
K
XX G H V
1
D J C SECTION X-X N N
R
A
B
BENT LEAD TAPE & REEL AMMO PACK
P T
SEATING PLANE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. MILLIMETERS MIN MAX 4.45 5.20 4.32 5.33 3.18 4.19 0.40 0.54 2.40 2.80 0.39 0.50 12.70 --- 2.04 2.66 1.50 4.00 2.93 --- 3.43 --- STYLE 1: PIN 1. EMITTER 2. BASE 3. COLLECTOR
K
XX G
D J V C SECTION X-X N
1
DIM A B C D G J K N P R V
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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6
2N6426/D


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